The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Oct. 05, 2010
Steve Canale, Simi Valley, CA (US);
David J. Zapp, Simi Valley, CA (US);
Daniel E. Sanchez, Camarillo, CA (US);
Hung V. Phan, Simi Valley, CA (US);
Hyong Y. Lee, Thousand Oaks, CA (US);
Steve Canale, Simi Valley, CA (US);
David J. Zapp, Simi Valley, CA (US);
Daniel E. Sanchez, Camarillo, CA (US);
Hung V. Phan, Simi Valley, CA (US);
Hyong Y. Lee, Thousand Oaks, CA (US);
Skyworks Solutions, Inc., Woburn, MA (US);
Abstract
Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.