The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Jun. 24, 2011
Hideyuki Abe, Himeji, JP;
Kazuaki Mawatari, Oita, JP;
Hideyuki Abe, Himeji, JP;
Kazuaki Mawatari, Oita, JP;
Ayumi Industry Co., Ltd., Himeji-Shi, Hyogo, JP;
Abstract
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agentis applied onto multiple substrates, and a heaterheats the substrates while the substrates are temporarily bonded with the temporary bonding agentinterposed therebetween, and before the solderis melted or while the solderis melted, the temporary bonding agentis evaporated, and the substratesare bonded with solder with the melted solderinterposed therebetween.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile