The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Jul. 06, 2011
Applicants:
Young-ja Kim, Asan-si, KR;
Junyoung Ko, Cheonan-si, KR;
Inventors:
Young-Ja Kim, Asan-si, KR;
Junyoung Ko, Cheonan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 1/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer dicing blade includes a cutting part including a protrusion, the protrusion having a uniform region with a substantially uniform width, and a support covering at least one sidewall of the cutting part, the protrusion of the cutting part extending beyond an edge of the support.
Kim, Young-Ja. (2014). Wafer dicing blade and wafer dicing apparatus including the same (U.S. Patent No. 8757134). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8757134
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile