The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Apr. 01, 2008
Applicants:

Russell A. Budd, North Salem, NY (US);

Punit P. Chiniwalla, New York, NY (US);

Chirag S. Patel, Peekskill, NY (US);

Inventors:

Russell A. Budd, North Salem, NY (US);

Punit P. Chiniwalla, New York, NY (US);

Chirag S. Patel, Peekskill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 21/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.


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