The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Jul. 06, 2012
Applicant:

Takashi Atsumi, Okazaki, JP;

Inventor:

Takashi Atsumi, Okazaki, JP;

Assignee:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H05K 5/02 (2006.01); H01L 21/00 (2006.01); H01L 23/64 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/647 (2013.01); H01L 23/4334 (2013.01);
Abstract

In order to prevent an increase in temperature of a discharge resistance discharging an electric charge accumulated in a smoothing capacitor, the present description discloses a power module. The power module has a first lead frame, a second lead frame, first and second semiconductor switches connected in series between the first lead frame and the second lead frame, a resistor connected between the first lead frame and the second lead frame, and a resin package that encapsulates the first lead frame, the second lead frame, the first semiconductor switch, the second semiconductor switch, and the resistor. In this power module, a radiator portion for radiating heat from the first lead frame and/or the second lead frame is formed in at least a part of the package.


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