The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Nov. 30, 2011
Applicants:

Masanori Minamio, Osaka, JP;

Zyunya Tanaka, Osaka, JP;

Ryoutarou Imura, Kyoto, JP;

Inventors:

Masanori Minamio, Osaka, JP;

Zyunya Tanaka, Osaka, JP;

Ryoutarou Imura, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A conduction path includes a first conduction path forming plate () made of a first metal and having a through hole (), and a second conduction path forming plate () made of a second metal and having a press-fit portion () press-fitted into the through hole. A wall surface of the through hole and a side surface of the press-fit portion forms an inclined bonding surface () inclined relative to a normal line of an overlap surface of the first conduction path forming plate and the second conduction path forming plate, and a bonding portion () formed by metal flow is formed in a region located in a periphery of the inclined bonding surface.


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