The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Oct. 07, 2009
Applicants:

Yoshinori Shimizu, Tokushima, JP;

Kensho Sakano, Anan, JP;

Yasunobu Noguchi, Tokushima, JP;

Toshio Moriguchi, Anan, JP;

Inventors:

Yoshinori Shimizu, Tokushima, JP;

Kensho Sakano, Anan, JP;

Yasunobu Noguchi, Tokushima, JP;

Toshio Moriguchi, Anan, JP;

Assignee:

Nichia Corporation, Anan-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/50 (2010.01); C09K 11/77 (2006.01); H05B 33/14 (2006.01); H01J 29/20 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/50 (2013.01); H01L 2224/73265 (2013.01); C09K 11/7767 (2013.01); G02B 6/0025 (2013.01); H01L 2924/01019 (2013.01); H01L 2933/0091 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/12041 (2013.01); Y02B 20/181 (2013.01); G02B 6/0073 (2013.01); H01L 33/56 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/3011 (2013.01); G02B 6/0023 (2013.01); G02B 6/0051 (2013.01); H01L 33/504 (2013.01); H01L 2924/01021 (2013.01); C09K 11/7774 (2013.01); H01L 33/502 (2013.01); H01L 33/501 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/01068 (2013.01); H01L 2224/48257 (2013.01); H05B 33/14 (2013.01); H01L 2924/15747 (2013.01); H01J 29/20 (2013.01);
Abstract

A light emitting diode having a mount lead having a cup and a lead, an LED chip mounted in the cup of said mount lead with one of electrodes being electrically connected to said mount lead, a coating material filling the cup of said mount lead to cover said LED chip; a molding material covering said LED chip, said coating material and the cup of said mount lead, and a phosphor absorbing a part of light emitted by said LED chip and emitting light of wavelength different from that of the absorbed light, wherein said phosphor is located in said coating material, and wherein said molding material is shaped to form a concave lens.


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