The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Dec. 20, 2010
Applicants:

Beibei Song, Zhaoqing, CN;

Yongsheng Song, Zhaoqing, CN;

Fangce MO, Zhaoqing, CN;

Juan LI, Zhaoqing, CN;

Xiaoguo Wang, Zhaoqing, CN;

Jinghua Guo, Zhaoqing, CN;

Inventors:

Beibei Song, Zhaoqing, CN;

Yongsheng Song, Zhaoqing, CN;

Fangce Mo, Zhaoqing, CN;

Juan Li, Zhaoqing, CN;

Xiaoguo Wang, Zhaoqing, CN;

Jinghua Guo, Zhaoqing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/00 (2006.01); H01L 27/108 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high-frequency and low-dielectric-constant ceramic dielectric material matched with nickel internal electrode and a method for producing capacitor using same. The ceramic dielectric material consists of main crystalline phase, modifying additive and sintering flux. The main crystalline phase is MgZrSiO, wherein 0.05≦x≦0.15. The modifying additive is one or more of MnO, AlO, CaO, BiOand TiO, and the sintering flux is one or more of BO, SiO, ZnO, LiO, KO and BaO. The ceramic dielectric material has good uniformity, and excellent dielectric properties, meets the requirements of COG characteristics in EIA standard, and meets the environmental requirements. The ceramic dielectric material can be sintered under the reducing atmosphere and can be matched with nickel electrodes. The chip multilayer ceramic capacitor made of the ceramic dielectric material and nickel internal electrodes has stable performance.


Find Patent Forward Citations

Loading…