The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2014
Filed:
Sep. 13, 2012
Applicants:
Hwang Kyu Yun, Irvine, CA (US);
Jeffrey Leon, Long Beach, CA (US);
Raj Peddi, Irvine, CA (US);
Younsang Kim, Irvine, CA (US);
Inventors:
Hwang Kyu Yun, Irvine, CA (US);
Jeffrey Leon, Long Beach, CA (US);
Raj Peddi, Irvine, CA (US);
YounSang Kim, Irvine, CA (US);
Assignee:
Henkel IP & Holding GmbH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/784 (2006.01); H01L 21/822 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/784 (2013.01); H01L 21/822 (2013.01); H01L 21/67132 (2013.01);
Abstract
A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.