The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Apr. 11, 2011
Applicants:

Said Rizk, Salem, NH (US);

David P. Martin, Arlington, MA (US);

Kicherl Ho, Groton, MA (US);

Simon F. Williams, Sherborn, MA (US);

Inventors:

Said Rizk, Salem, NH (US);

David P. Martin, Arlington, MA (US);

Kicherl Ho, Groton, MA (US);

Simon F. Williams, Sherborn, MA (US);

Assignee:

Tepha, Inc., Lexington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 55/04 (2006.01); B29C 55/12 (2006.01); A61L 27/18 (2006.01); A61L 27/58 (2006.01); C08L 67/04 (2006.01); C08G 63/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

Continuous processing methods for making absorbable polymeric films with one or more of the following properties: high toughness, low modulus, high tensile strength, and thickness less than 10 mm, more preferably less than 1 mm, and more preferably less than 100 μm, have been developed. In the preferred embodiment, the polymer is a polyhydroxyalkanoate, and in the most preferred embodiment, the polymer comprises 4-hydroxybutyrate. A particularly preferred embodiment is a film of poly-4-hydroxybutyrate or copolymer thereof, wherein the film has a tensile strength greater than 5.5 kgf/mm, tensile modulus less than 181 kgf/mm, and elongation at break from 10-500%, wherein the film is derived by a continuous process such as melt extrusion or solvent casting, followed by orientation to more than 25% of the film's original length in one or more directions. These can be used for a variety of purposes including fabrication of medical devices.


Find Patent Forward Citations

Loading…