The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2014
Filed:
Jan. 18, 2011
Takashi Shoji, Chichibu, JP;
Takekazu Sakai, Yokohama, JP;
Takashi Shoji, Chichibu, JP;
Takekazu Sakai, Yokohama, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.