The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Aug. 05, 2011
Shinsuke Asada, Chiyoda-ku, JP;
Yuetsu Watanabe, Chiyoda-ku, JP;
Yoshihito Asao, Chiyoda-ku, JP;
Kenjiro Nagao, Chiyoda-ku, JP;
Shinsuke Asada, Chiyoda-ku, JP;
Yuetsu Watanabe, Chiyoda-ku, JP;
Yoshihito Asao, Chiyoda-ku, JP;
Kenjiro Nagao, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.