The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Nov. 19, 2012
Seiko Instruments Inc., Chiba, JP;
Keitaro Koroishi, Chiba, JP;
Norimitsu Sanbongi, Chiba, JP;
Noriyoshi Shoji, Chiba, JP;
Toshimitsu Morooka, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a concave portion; thinning the upper substrate bonded onto the support substrate; a measurement step of measuring a thickness of the thinned upper substrate; determining a target resistance value of a heating resistor from the following expression based on the measured thickness of the upper substrate; and forming the heating resistor having the target resistance value at a position opposed to the concave portion, Rh=R×(1+(D+D)/(D+K)) where Rh represents the target resistance value; R, a design resistance value; D, the thickness of the upper substrate; D, a design thickness of the upper substrate; and K, a heating efficiency coefficient.