The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Dec. 12, 2012
Taiyo Yuden Co., Ltd., Tokyo, JP;
Osamu Takahashi, Gunma, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
A laminated electronic component with adjacent wires (such as coil conductors) in insulator layers inter-connected through via holes, wherein its laminate is structured in such a way that a coil-embedded layer constituted by first insulator layers and second insulator layers laminated alternately is sandwiched between a top magnetic layer and bottom magnetic layer, with external electrodes formed on both end faces. First coil conductors are formed on the first insulator layers and second coil conductors are formed on the second insulator layers, with these coil conductors connected through via holes. Formed at the end of each second coil conductor is a connection conductor of a size sufficiently large to block off the top of the via hole provided in the insulator sheet. By discharging the air in the via hole by means of pressure-bonding the laminate, the connection conductor will have a part filling inside the via hole and another part projecting on top of the via hole, with the center of the via hole recessed, to prevent shorting and cracking.