The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Aug. 30, 2011
Masayuki Ohta, Osaka, JP;
Masaki Tatsumi, Osaka, JP;
Yoshiki Sota, Osaka, JP;
Kazuo Tamaki, Osaka, JP;
Shinji Yamaguchi, Osaka, JP;
Masamichi Harada, Osaka, JP;
Shin Ito, Osaka, JP;
Tomoshi Kimura, Osaka, JP;
Yoshifumi Inada, Osaka, JP;
Masayuki Ohta, Osaka, JP;
Masaki Tatsumi, Osaka, JP;
Yoshiki Sota, Osaka, JP;
Kazuo Tamaki, Osaka, JP;
Shinji Yamaguchi, Osaka, JP;
Masamichi Harada, Osaka, JP;
Shin Ito, Osaka, JP;
Tomoshi Kimura, Osaka, JP;
Yoshifumi Inada, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A semiconductor apparatus according to the present invention with a semiconductor element implemented on an insulated substrate comprises: a substrate front surface electrode formed on a front surface side of the insulated substrate and connected with an element electrode of the semiconductor element; a substrate back surface electrode formed on a back surface side of the insulated substrate and electrically connected with the substrate front surface electrode; and a plurality of connection electrodes, extending in a thickness direction of the insulated substrate from one side to the other side of a front surface and a back surface thereof, for electrically connecting the substrate front surface electrode with the substrate back surface electrode, where the substrate front surface electrode or the substrate back surface electrode is formed to have a plane pattern separated for each of the plurality of connection electrodes.