The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Oct. 13, 2010
Michael D. Fogarty, Auburn, WA (US);
William J. Tapia, Kapowsin, WA (US);
Gary E. Georgeson, Tacoma, WA (US);
Martin L. Freet, Federal Way, WA (US);
Jeffrey G. Thompson, Kent, WA (US);
David W. Anderson, Kent, WA (US);
Ronald E. Vonwahlde, Puyallup, WA (US);
Michael D. Fogarty, Auburn, WA (US);
William J. Tapia, Kapowsin, WA (US);
Gary E. Georgeson, Tacoma, WA (US);
Martin L. Freet, Federal Way, WA (US);
Jeffrey G. Thompson, Kent, WA (US);
David W. Anderson, Kent, WA (US);
Ronald E. VonWahlde, Puyallup, WA (US);
The Boeing Company, Chicago, IL (US);
Abstract
Methods and systems are provided for measuring a thickness of an object. A first portion of a device is positioned on a first side of the object, and a second portion of the device is positioned on an opposite side of the object. The first portion includes at least one first mount and at least one eddy current sensor coupled to the first mount. The second portion includes at least one second mount and at least one target coupled to the second mount. The first mount is magnetically coupled to the second mount such that the eddy current sensor is oriented to interact with the target to enable the thickness of the object to be measured.