The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2014

Filed:

Apr. 18, 2012
Applicants:

Tetsuto Yamagishi, Nukata-gun, JP;

Tohru Nomura, Kariya, JP;

Norihisa Imaizumi, Toyokawa, JP;

Yasutomi Asai, Okazaki, JP;

Inventors:

Tetsuto Yamagishi, Nukata-gun, JP;

Tohru Nomura, Kariya, JP;

Norihisa Imaizumi, Toyokawa, JP;

Yasutomi Asai, Okazaki, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.


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