The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Aug. 27, 2010
Zhimin MO, Lund, SE;
Zhimin Mo, Lund, SE;
ST-Ericsson SA, Plan-les-Ouates, CH;
Abstract
An electronic device is disclosed. The electronic device comprises at least one electronic chip and a package for the electronic chip. The package comprises a laminate substrate, wherein the electronic chip is attached on the laminate substrate. The laminate substrate comprises one or more conduction layers, one or more insulation layers and a plurality of pads formed in a conduction layer on the side of the laminate substrate opposite to the side connected to the electronic chip. Furthermore, the package comprises an insulation body formed around the electronic chip. Moreover, the package comprises a plurality of electrodes that extend through the insulation body. For each pad of the laminate substrate, wiring is formed in the one or more of conduction layers and in one or more vias passing through the one or more insulation layers for electrically connecting the pad with at least one of the electrodes. The package further comprises an interconnection body formed on the insulation body and the electronic chip. The interconnection body comprises a plurality of pads on the side of the interconnection body opposite to the side connected to the insulation body and the electronic chip and it also comprises wiring inside the interconnection body for electrical connections between the pads of the electronic chip, the electrodes and the pads of the interconnection body. A method for manufacturing the electronic device is also disclosed.