The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2014

Filed:

Oct. 05, 2011
Applicants:

Takahito Watanabe, Kanagawa, JP;

Shintaro Yamamichi, Kanagawa, JP;

Yoshitaka Ushiyama, Kanagawa, JP;

Inventors:

Takahito Watanabe, Kanagawa, JP;

Shintaro Yamamichi, Kanagawa, JP;

Yoshitaka Ushiyama, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/02 (2006.01); H01L 29/82 (2006.01); H01L 31/0203 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor chip includes a magnetic storage device and includes an electrode pad on a first face. The semiconductor chip is coated with a magnetic shield layer in a state in which at least the electrode pad is exposed. The semiconductor chip is mounted on an interconnect substrate through a bump. At least one of the semiconductor chip and the interconnect substrate includes a convex portion, and the bump is disposed over the convex portion.


Find Patent Forward Citations

Watanabe, Takahito. (2014). Semiconductor device and method of manufacturing semiconductor device (U.S. Patent No. 8749033). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8749033

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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