The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2014

Filed:

Sep. 09, 2011
Applicants:

Terunao Hanaoka, Suwa, JP;

Akinori Shindo, Hokuto, JP;

Yasuo Yamasaki, Shiojiri, JP;

Seiichi Chiba, Mihowa-machi, JP;

Toshiyuki Enta, Akumi-gun, JP;

Shuji Kojima, Kamiina-gun, JP;

Inventors:

Terunao Hanaoka, Suwa, JP;

Akinori Shindo, Hokuto, JP;

Yasuo Yamasaki, Shiojiri, JP;

Seiichi Chiba, Mihowa-machi, JP;

Toshiyuki Enta, Akumi-gun, JP;

Shuji Kojima, Kamiina-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01P 15/097 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component includes: a semiconductor element including a circuit; a vibration element; a first electrode arranged on a first surface of the semiconductor element and connected to the circuit and the vibration element arranged on the first surface side; a second electrode arranged on the first surface; a first wiring board including a first wire connected to the second electrode; and a second wiring board including a second wire to which the first wire is connected. At least a part of an inner side region of an outer contour of the vibration element is arranged to overlap the second electrode in plan view facing the first surface.


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