The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2014

Filed:

Nov. 03, 2011
Applicants:

Michael D. Camras, Sunnyvale, CA (US);

William R. Imler, Oakland, CA (US);

Franklin J. Wall, Jr., Vacaville, CA (US);

Frank M. Steranka, San Jose, CA (US);

Michael R. Krames, Mountain View, CA (US);

Helena Ticha, Srch, CZ;

Ladislav Tichy, Srch, CZ;

Robertus G. Alferink, Son, NL;

Inventors:

Michael D. Camras, Sunnyvale, CA (US);

William R. Imler, Oakland, CA (US);

Franklin J. Wall, Jr., Vacaville, CA (US);

Frank M. Steranka, San Jose, CA (US);

Michael R. Krames, Mountain View, CA (US);

Helena Ticha, Srch, CZ;

Ladislav Tichy, Srch, CZ;

Robertus G. Alferink, Son, NL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.


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