The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Nov. 19, 2009
Toshiaki Chuma, Tokyo, JP;
Masayoshi Kondo, Tokyo, JP;
Satoshi Tanaka, Tokyo, JP;
Kenichi Kanemasa, Tokyo, JP;
Toshiaki Chuma, Tokyo, JP;
Masayoshi Kondo, Tokyo, JP;
Satoshi Tanaka, Tokyo, JP;
Kenichi Kanemasa, Tokyo, JP;
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Abstract
Disclosed is an electronic component package () including a circuit board (), an electronic component (), and an adhesive layer (). The circuit board () is provided with an electrically-conductive conductor post () which is buried in a base member (), and a solder layer () which is provided at the front end () of the conductor post () while exposed from a surface () of the base member (). An electrode pad () having a metal layer () mounted thereon is provided on the main surface () of the electronic component (). The adhesive layer () contains a flux activating compound, and bonds the surface () of the base member () and the main surface () of the electronic component (). Then, the metal layer () and the solder layer () are metal-bonded.