The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2014

Filed:

Mar. 31, 2011
Applicants:

Tao Xie, Troy, MI (US);

Hamid G. Kia, Bloomfield Hills, MI (US);

William R. Rodgers, Bloomfield Township, MI (US);

Man Zhang, Wilmington, DE (US);

Chen-shih Wang, Troy, MI (US);

Inventors:

Tao Xie, Troy, MI (US);

Hamid G. Kia, Bloomfield Hills, MI (US);

William R. Rodgers, Bloomfield Township, MI (US);

Man Zhang, Wilmington, DE (US);

Chen-Shih Wang, Troy, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming an adhesive bond between a first substrate and a second substrate includes applying a semi-crystalline polymeric adhesive composition to a bonding area of the first substrate, and, after applying, disposing the second substrate adjacent to and in contact with the composition to form a workpiece. After disposing, the method includes heating the workpiece to cure the composition and thereby form a crosslinked polymeric adhesive material. After heating, the method includes cooling the workpiece such that the material has a crystalline molecular structure. Concurrent to cooling, the method includes imposing a stress on the material to thereby orient the crystalline molecular structure in a desired direction, and, after imposing, dissipating the stress along the crystalline molecular structure in the desired direction to thereby form the adhesive bond between the first substrate and the second substrate.


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