The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Mar. 05, 2009
Mamoru Hamada, Tokyo, JP;
Fumitake Unezaki, Tokyo, JP;
Yoshihiro Takahashi, Tokyo, JP;
Kengo Takahashi, Tokyo, JP;
Kazuki Okada, Tokyo, JP;
Shinichi Uchino, Tokyo, JP;
Mamoru Hamada, Tokyo, JP;
Fumitake Unezaki, Tokyo, JP;
Yoshihiro Takahashi, Tokyo, JP;
Kengo Takahashi, Tokyo, JP;
Kazuki Okada, Tokyo, JP;
Shinichi Uchino, Tokyo, JP;
Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;
Abstract
A heat pump apparatus includes a refrigerant circuit in which a compressor, a condenser, expansion means, and an evaporator are serially connected. Condensation temperature detection means that detects a saturation temperature of the condenser, and evaporation temperature detection means that detects the saturation temperature of the evaporator are provided. Operation efficiency is estimated by a value obtained by dividing heating ability estimated from a detection value of the condensation temperature detection means by a difference between a detection value of condensation temperature detection means and that of evaporation temperature detection means or dissipation power estimated by the difference.