The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
May. 16, 2012
Shozo Ochi, Osaka, JP;
Yoshitake Hayashi, Osaka, JP;
Kazuo Ohtani, Osaka, JP;
Yosuke Maeba, Osaka, JP;
Shozo Ochi, Osaka, JP;
Yoshitake Hayashi, Osaka, JP;
Kazuo Ohtani, Osaka, JP;
Yosuke Maeba, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.