The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2014

Filed:

Feb. 22, 2011
Applicants:

Dominic Schroeder, Warensdorf, DE;

Matthias Schroeder, Stadtroda, DE;

Inventors:

Dominic Schroeder, Warensdorf, DE;

Matthias Schroeder, Stadtroda, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); B23K 35/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.


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