The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Feb. 09, 2011
Nobutaka Itoh, Kawasaki, JP;
Makoto Sakairi, Kawasaki, JP;
Mami Nakadate, Kawasaki, JP;
Yoshiteru Ochi, Kawasaki, JP;
Akiyoshi Saitou, Kawasaki, JP;
Nobutaka Itoh, Kawasaki, JP;
Makoto Sakairi, Kawasaki, JP;
Mami Nakadate, Kawasaki, JP;
Yoshiteru Ochi, Kawasaki, JP;
Akiyoshi Saitou, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.