The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2014

Filed:

Feb. 11, 2013
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Paul Y. Wu, Saratoga, CA (US);

Richard L. Wheeler, San Jose, CA (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect array is described. The interconnect array comprises a pattern of adjacent interconnect tiles, each interconnect tile comprising ten interconnect locations including eight I/O signal connectivity locations forming a perimeter array having a corner I/O signal connectivity location, a center connectivity location surrounded by the eight I/O signal connectivity locations in the perimeter array being a first ground connectivity location or a power connectivity location, and a second ground connectivity location adjacent to the corner I/O signal connectivity location of the perimeter array and externally offset from the perimeter array to form an asymmetrically shaped interconnect tile. At least one interconnect tile of the pattern of adjacent interconnect tiles has a center connectivity location that is a power connectivity location.


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