The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Mar. 09, 2012
Takaaki Hirano, Kanagawa, JP;
Takaaki Hirano, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
Disclosed herein is a semiconductor device including: a first laminate having a wiring layer formed on a substrate; a second laminate having a wiring layer formed on a substrate, a principal surface of the second laminate being bonded to a principal surface of the first laminate; a functional element disposed in at least one of the first laminate and the second laminate; and an air gap penetrating an interface between the first laminate and the second laminate, the air gap being disposed on an outside of a circuit formation region including the functional element in at least one of the first laminate and the second laminate as viewed from a direction perpendicular to the principal surfaces of the first laminate and the second laminate.