The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Jun. 22, 2012
Applicants:
Seok-chan Lee, Seoul, KR;
Min-woo Kim, Seoul, KR;
Inventors:
Seok-Chan Lee, Seoul, KR;
Min-Woo Kim, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Samsung-ro,Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip is provided. The semiconductor chip includes a semiconductor substrate, a circuit on the substrate, an insulating layer formed on the circuit, and a plurality of electrically floating conductor lines formed on the insulating layer, at a major surface of the semiconductor chip.
Lee, Seok-Chan. (2014). Electrical connection for multichip modules (U.S. Patent No. 8742593). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8742593
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile