The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Jul. 17, 2009
Kenichi Kawabata, Tokyo, JP;
Toshikazu Endo, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Toshikazu Endo, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A semiconductor embedded moduleof the present invention has a configuration in which a semiconductor device, which is an electronic component such as a semiconductor IC (die) in a bare chip state, is embedded in a resin layer(second insulating layer). In the semiconductor device, a redistribution layeris connected to land electrodes. A protective layer(first insulating layer) is provided on the redistribution layer, and is provided with openings such that external connection pads P of the redistribution layerare exposed. Also, the resin layeris formed to cover the protective layer, and vias V are formed at the positions of the respective external connection pads P of the redistribution layer. The grinding rate of the resin layeris larger than that of the protective layer