The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Dec. 02, 2011
Yoshihito Sato, Ushiku, JP;
Nobuhiro Arai, Ushiku, JP;
Jun Matsui, Nagahama, JP;
Shingetsu Yamada, Nagahama, JP;
Shuuji Suzuki, Nagahama, JP;
Yoshihito Sato, Ushiku, JP;
Nobuhiro Arai, Ushiku, JP;
Jun Matsui, Nagahama, JP;
Shingetsu Yamada, Nagahama, JP;
Shuuji Suzuki, Nagahama, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.