The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Jan. 16, 2012
Sangyoung Kim, Asan-si, KR;
Jaereyun Jung, Yongin-si, KR;
Sanggug Lee, Yongin-si, KR;
Jongtae Park, Yongin-si, KR;
Sangyoung Kim, Asan-si, KR;
Jaereyun Jung, Yongin-si, KR;
Sanggug Lee, Yongin-si, KR;
Jongtae Park, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A method of manufacturing a semiconductor module is provided. The method includes forming semiconductor chips on a bare substrate, performing a burn-in process on the bare substrate including the semiconductor chips, sorting semiconductor chips that exceed a predetermined level of operability determined by testing electrical driving in the semiconductor chips on the burned-in bare substrate, separating the semiconductor chips from one another by cutting the bare substrate, and directly mounting the module semiconductor chips on a module substrate.