The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Sep. 09, 2010
Yo Shimazaki, Shinjuku-ku, JP;
Hiroyuki Saito, Shinjuku-ku, JP;
Masachika Masuda, Shinjuku-ku, JP;
Kenji Matsumura, Shinjuku-ku, JP;
Masaru Fukuchi, Shinjuku-ku, JP;
Takao Ikezawa, Shinjuku-ku, JP;
Yo Shimazaki, Shinjuku-ku, JP;
Hiroyuki Saito, Shinjuku-ku, JP;
Masachika Masuda, Shinjuku-ku, JP;
Kenji Matsumura, Shinjuku-ku, JP;
Masaru Fukuchi, Shinjuku-ku, JP;
Takao Ikezawa, Shinjuku-ku, JP;
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Abstract
A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.