The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
May. 11, 2011
Shinji Yamamoto, Yamanashi, JP;
Yasuyuki Ishitani, Yamanashi, JP;
Shinji Yamamoto, Yamanashi, JP;
Yasuyuki Ishitani, Yamanashi, JP;
Panasonic Corporation, Osaka, JP;
Abstract
It is an object to provide an electronic component mounting method that makes it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tapealready loaded on a tape feeder to a newly loaded carrier tapeA, when an optical sensorhas detected a joint J between the already-loaded carrier tapeand the newly-loaded carrier tapeA, a height measurement deviceperforms measurement of a component pickup height targeted for components P housed in the carrier tapeA in connection with the tape feeder for which the joint J has been detected. Component pickup height data showing a target lowering height to which pickup nozzlesare to be lowered are updated on the basis of the measurement result.