The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Jan. 14, 2011
Yang Zhang, San Diego, CA (US);
Yongsheng Peng, San Diego, CA (US);
Jack B. Steenstra, San Diego, CA (US);
Yang Zhang, San Diego, CA (US);
Yongsheng Peng, San Diego, CA (US);
Jack B. Steenstra, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A modular package may be utilized to mount an RF system-on-chip in one of plural configurations, such that the same modular package may be utilized to enable plural device formats, while reducing the amount of RF testing needed to change device formats. In one configuration, a surface mount device is mounted onto a first surface of a board, and the board is directly surface mounted onto a base board. Here, the base board includes a hole for accommodating the surface mount device, providing a thin device format. In a second configuration, a spacer is mounted onto the first surface of the board, such that a gap is provided between the board and the base board for accommodating the surface mount device, providing a relatively thicker device, but providing additional surface area where the hole otherwise would be, reducing the device size.