The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Dec. 02, 2010
Shinichiro Busujima, Kita-Ku, JP;
Yoichi Miura, Kawagoe, JP;
Kenro Hirata, Itabashi, JP;
Tempei Yamaoka, Tsukuba, JP;
Shinichiro Busujima, Kita-Ku, JP;
Yoichi Miura, Kawagoe, JP;
Kenro Hirata, Itabashi, JP;
Tempei Yamaoka, Tsukuba, JP;
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Abstract
A suspension circuit board comprises a metal support board, a first insulation layer disposed on the metal support board a conductive layer disposed on the first insulation layer, the conductive layer forming a wire; and a second insulation layer disposed on the first insulation layer and the conductive layer. The suspension circuit board is configured that, upon applying a load in a thickness direction to the conductive layer at a position corresponding to the first insulation opening, F<F, when a stress generated in the conductive layer at a position corresponding to a periphery of the first insulation opening is represented as a first stress Fand a stress generated in the conductive layer at a position corresponding to a periphery of the metal support board opening is represented as a second stress F.