The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Aug. 31, 2007
Jeff Devereux, Solana Beach, CA (US);
Fritz Gerd Berger, Vista, CA (US);
William A. Johnston, Poway, CA (US);
Mohammad Ali Tassoudji, Cardiff, CA (US);
Scott Aldern, Encinitas, CA (US);
Jeff Devereux, Solana Beach, CA (US);
Fritz Gerd Berger, Vista, CA (US);
William A. Johnston, Poway, CA (US);
Mohammad Ali Tassoudji, Cardiff, CA (US);
Scott Aldern, Encinitas, CA (US);
Omnitracs, LLC, San Diego, CA (US);
Abstract
A coaxial to microstrip transition is introduced in a multi layer mixed dielectric printed circuit board environment that provides a 50 Ohm impedance system between a coaxial antenna feed and a surface mount diplexer at Ku-band frequencies. The 50 Ohm transition from the coaxial antenna feed to the diplexer at microwave frequencies lossy FR-4 style laminate is provided by constructing a PCB internal coax using the center conductor of the antenna feed and a dual ring of plated through hole VIAs. The transition from the PCB internal coax to the microstrip section of the high frequency laminate PCB layer uses a 'D'-style opening in the ground layer and a VIA ring arrangement between the layers to optimize or tune the performance of the transition. Additional features in the interface construction are implemented to guaranty that its microwave and mechanical performance does not degrade in extreme environmental conditions.