The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Nov. 30, 2011
Jong Man Kim, Gyunggi-do, KR;
Young Hoon Kwak, Gyunggi-do, KR;
Kyu Hwan OH, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Tae Hoon Kim, Gyunggi-do, KR;
Jong Man Kim, Gyunggi-do, KR;
Young Hoon Kwak, Gyunggi-do, KR;
Kyu Hwan Oh, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Tae Hoon Kim, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.