The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Oct. 18, 2011
Lee Hua Alvin Seah, Singapore, SG;
Lee Hua Alvin Seah, Singapore, SG;
STMicroelectronics Asia Pacific PTE Ltd., Singapore, SG;
Abstract
A semiconductor package is provided, including a laminate substrate with an aperture sized to receive a semiconductor die. Through-holes in the substrate are filled with a thermally conductive adhesive. A first heat spreader is attached to the by the adhesive, and a semiconductor die is positioned in the aperture with a back face in thermal contact with the heat spreader. Wire bonds couple the die to electrical traces on the substrate. A second heat spreader is attached by the adhesive to the substrate over the die, directly opposite the first heat spreader. A portion of the second heat spreader is encapsulated in molding compound. Openings in the second heat spreader admits molding compound to fill the space around the die between the heat spreaders. Heat is transmitted from the die to the first spreader, and thence, via the through-holes and conductive paste, to the second heat spreader.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile