The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2014

Filed:

Jul. 09, 2012
Applicants:

Akitoyo Konno, Hitachi, JP;

Katsunori Azuma, Hitachi, JP;

Takashi Ando, Hitachi, JP;

Inventors:

Akitoyo Konno, Hitachi, JP;

Katsunori Azuma, Hitachi, JP;

Takashi Ando, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01L 23/49 (2006.01); H01L 25/07 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49 (2013.01); H01L 25/072 (2013.01); H01L 29/417 (2013.01);
Abstract

A power semiconductor device is provided in which reliability can be improved when the parallel number of semiconductor devices increases. When a bonding face on collector electrode is on an upper side, and a bonding face on emitter electrode is on a lower side, a collector electrode joint region as a joint region between a collector trace and a collector electrode on a chip mounted substrate and an emitter electrode joint region as a joint region between an emitter trace and an emitter electrode are located at a same position in an up-and-down direction and are adjacent in a right-and-left direction at an interval of 2 mm or more and 4 mm or less.


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