The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Nov. 18, 2009
Markus Graf, Zürich, CH;
Werner Hunziker, Stäfa, CH;
Franziska Brem, Küshacht, CH;
Felix Mayer, Stäfa, CH;
Markus Graf, Zürich, CH;
Werner Hunziker, Stäfa, CH;
Franziska Brem, Küshacht, CH;
Felix Mayer, Stäfa, CH;
Sensirion AG, Stafa, CH;
Abstract
The sensor assembly comprises a substrate (), such as a flexible printed circuit board, and a sensor chip () flip-chip mounted to the substrate (), with a first side () of the sensor chip () facing the substrate (). A sensing area () and contact pads () are integrated on the first side () of the sensor chip (). Underfill () and/or solder flux is arranged between the sensor chip () and the substrate (). The sensor chip () extends over an edge () of the substrate (), with the edge () of the substrate () extending between the contact pads () and the sensing area () over the whole sensor chip (). A dam () can be provided along the edge () of the substrate () for even better separation of the underfill () and the sensing area (). This de sign allows for a simple alignment of the sensor chip on the substrate () and prevents underfill () from covering the sensing area ().