The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Jul. 08, 2009
Konstantin Borisov, York, PA (US);
Michael S. Todd, Jacobus, PA (US);
Shreesha Adiga-manoor, York, PA (US);
Ivan Jadric, York, PA (US);
Konstantin Borisov, York, PA (US);
Michael S. Todd, Jacobus, PA (US);
Shreesha Adiga-Manoor, York, PA (US);
Ivan Jadric, York, PA (US);
Johnson Controls Technology Company, Holland, MI (US);
Abstract
A grounding system for a semiconductor module of a variable speed drive includes a first conductive layer, a second conductive layer; a substrate disposed between the first conductive layer and the second conductive layer; and a base attached to the second conductive layer, the base being connected to earth ground via a grounding harness. The first conductive layer is in electrical contact with the semiconductor module and the substrate, and electrically insulated from the second conductive layer by the substrate. The second conductive layer is in electrical contact with the substrate and disposed between the substrate and the base in electrical communication with an earth ground. The first conductive layer, the substrate and the second conductive layer form a capacitance path between the semiconductor module and the base as well as electrical conductors and the base for reduction circulating currents within the semiconductor module.