The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2014

Filed:

Jul. 31, 2006
Applicants:

James Ibbetson, Santa Barbara, CA (US);

Eric Tarsa, Goleta, CA (US);

Michael Leung, Ventura, CA (US);

Maryanne Becerra, Santa Barbara, CA (US);

Bernd Keller, Santa Barbara, CA (US);

Inventors:

James Ibbetson, Santa Barbara, CA (US);

Eric Tarsa, Goleta, CA (US);

Michael Leung, Ventura, CA (US);

Maryanne Becerra, Santa Barbara, CA (US);

Bernd Keller, Santa Barbara, CA (US);

Assignee:

Cree, Inc., Goleta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.


Find Patent Forward Citations

Ibbetson, James. (2014). Light emitting diode package with optical element (U.S. Patent No. 8735920). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8735920

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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