The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Mar. 20, 2006
Koji Kuno, Hamamatsu, JP;
Tatsuya Suzuki, Hamamatsu, JP;
Koji Kuno, Hamamatsu, JP;
Tatsuya Suzuki, Hamamatsu, JP;
Hamamatsu Photonicks K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A laser processing method which can reduce the chipping generated when a plate-like object to be processed formed with a modified region is turned into small pieces in steps other than its dividing step. In a part extending along a line to cut in an object to be processed, laser light is oscillated in a pulsing fashion in an intermediate portion including an effective part, and is continuously oscillated in one end portion and the other end portion on both sides of the intermediate portion. Since the laser light intensity becomes lower in continuous oscillation than in pulse oscillation, modified regions can be formed in the intermediate portion but not in one end portion and the other end portion. This keeps the modified regions from reaching the outer face of the substrate, thus making it possible to prevent particles from occurring when forming the modified regions.