The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Sep. 23, 2011
Jae-wook Yoo, Suwon-si, KR;
Sun-kyoung Seo, Suwon-si, KR;
Jae-Wook Yoo, Suwon-si, KR;
Sun-Kyoung Seo, Suwon-si, KR;
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Provided are a stacked package, method of fabricating a stacked package, and method of mounting a stacked package. A method includes providing an upper semiconductor package including an upper package substrate, upper semiconductor chips formed on a top surface of the upper package substrate, and first solders formed on a bottom surface of the upper package substrate and having a first melting temperature, providing a lower semiconductor package including a lower package substrate, lower semiconductor chips formed on a top surface of the lower package substrate, and solder paste nodes formed on the top surface of the lower package substrate and having a second melting temperature lower than the first melting temperature, and forming inter-package bonding units by attaching respective first solders and solder paste nodes to each other by performing annealing at a temperature higher than the second melting temperature and lower than the first melting temperature.