The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2014

Filed:

Feb. 01, 2008
Applicants:

Tetsuji Ohta, Tokyo, JP;

Keiko Kitamura, Saitama, JP;

Mitsuhiro Watanabe, Yokosuka, JP;

Inventors:

Tetsuji Ohta, Tokyo, JP;

Keiko Kitamura, Saitama, JP;

Mitsuhiro Watanabe, Yokosuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/00 (2006.01); B32B 5/16 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/09 (2006.01); B32B 27/14 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. The material includes a non-conductive base material and a catalyst adhering layer, provided on the non-conductive base and including a water-insoluble polyester resin The catalyst adhering layer shows a contact angle of 60° or smaller to purified water.


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