The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Sep. 21, 2011
David E. Havens, Bellbrook, OH (US);
Matthew C. Everhart, Fairborn, OH (US);
Thomas Wood Margraf, Centerville, OH (US);
Joel James Everhart, Xenia, OH (US);
Randy Rex Kysar, Derby, KS (US);
Carl Ray Fiegenbaum, Rose Hill, KS (US);
Jeffrey W. Priest, Rose Hill, KS (US);
Delbert Leon Strelow, Wichita, KS (US);
Kristin Dru Pickell, Sandy, UT (US);
David E. Havens, Bellbrook, OH (US);
Matthew C. Everhart, Fairborn, OH (US);
Thomas Wood Margraf, Centerville, OH (US);
Joel James Everhart, Xenia, OH (US);
Randy Rex Kysar, Derby, KS (US);
Carl Ray Fiegenbaum, Rose Hill, KS (US);
Jeffrey W. Priest, Rose Hill, KS (US);
Delbert Leon Strelow, Wichita, KS (US);
Kristin Dru Pickell, Sandy, UT (US);
Spirit AeroSystems, Inc., Wichita, KS (US);
Abstract
A method and apparatus for fabricating a composite part with a shape memory polymer (SMP) apparatus usable as both a rigid lay-up tool and as a bladder. The SMP apparatus may be heated until malleable, shaped, and then cooled in a desired rigid tool configuration. For example, cavities may be formed into the SMP apparatus for nesting components therein to co-bond or co-cure with the composite part. The composite material may be applied onto the SMP apparatus in the rigid tool configuration and then placed into a rigid external tool and heated to composite cure temperatures at which the SMP apparatus is malleable. A pressure differential may be induced which urges the SMP apparatus to compress the composite material against the rigid external tool. When the composite material is cured, the SMP apparatus may be urged away from the cure composite material and removed from within the composite part.