Power interconnect integrity detection

Abstract

Embodiments include systems and methods for detecting and/or responding to deficiencies in power interconnect integrity. For example, a first module distributes power to a second module via a high-current mechanical power interconnect. Insufficient integrity in the interconnect can manifest as an impedance, causing potential thermal hazards. A separate (e.g., low-current) interconnect is used to monitor the power being received by the second module from the first module. Embodiments detect when a difference between the power supplied to and received by the second module exceeds a threshold difference, which can indicate deficient interconnect integrity (i.e., a fault). The supply of high-current power to the second module can be substantially immediately interrupted upon detecting the fault.