The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Oct. 05, 2011
Applicants:

Hiroki Kobayashi, Chiryu, JP;

Takanori Sakurai, Kitanagoya, JP;

Yuji Hori, Nagoya, JP;

Yasunori Iwasaki, Kitanagoya, JP;

Inventors:

Hiroki Kobayashi, Chiryu, JP;

Takanori Sakurai, Kitanagoya, JP;

Yuji Hori, Nagoya, JP;

Yasunori Iwasaki, Kitanagoya, JP;

Assignee:

NGK Insulators, Ltd., Aichi-prefecture, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0585 (2013.01); H03H 9/02622 (2013.01);
Abstract

According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surfaceto fill the minute asperities, thereby forming a filling layer, (c) a surface of the filling layer is mirror-polished to such an extent that an arithmetic mean roughness Ra of the surface of the filling layer is smaller than an arithmetic mean roughness Ra of the rear surfacein a state of above (a), and (d) the surface of the filling layer and a surface of the support substrate are bonded to each other with an adhesive layer interposed therebetween, thereby forming a composite substrate.


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